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Solder Reflow Profile
T P
T C -5°C
T a b l e 1 - S t a n d a r d S n P b S o l d e r ( T c )
T L
Max. Ramp Up Rate = 3°C/s
Max. Ramp Down Rate = 6°C/s
t P
Package
Thickne ss
Vol u me
mm 3
<350
Vol u me
mm 3
_ > 350
T smax
Preheat
A
t
<2.5mm
>_2.5mm
235° C
220° C
220° C
220° C
T a b l e 2 - L e ad ( P b ) Fr e e S o l d e r ( T c )
T smin
t s
Package
Thickne ss
<1. 6 mm
1. 6 – 2.5mm
>2.5mm
Vol u me
mm 3
<350
2 6 0° C
2 6 0° C
250° C
Vol u me
mm 3
350 - 2000
2 6 0° C
250° C
245° C
Vol u me
mm 3
>2000
2 6 0° C
245° C
245° C
25°C
Time 25°C to Peak
Time
Reference JDEC J-STD-020D
Profile Feat u re
Standard SnP b Solder
Lead (P b ) Free Solder
Pr e h ea t a n d S o a k
? T e mp e r a tur e min. (Tsmin)
100° C
150° C
? T e mp e r a tur e m a x. (Tsm a x)
? Tim e (Tsmin to Tsm a x) (ts)
Av e r a g e r a mp up r a t e Tsm a x to Tp
Liqui d ous t e mp e r a tur e (T L )
Tim e a t liqui d ous (tL)
P ea k p a ck a g e b o d y t e mp e r a tur e (TP) *
Tim e (tp) ** within 5 ° C of th e sp e cifi ed cl a ssific a tion t e mp e r a tur e (Tc)
Av e r a g e r a mp- d own r a t e (Tp to Tsm a x)
Tim e 25° C to P ea k T e mp e r a tur e
150° C
6 0-120 Se con d s
3° C / Se con d M a x.
183° C
6 0-150 Se con d s
T ab l e 1
20 Se con d s **
6 ° C / Se con d M a x.
6 Minut e s M a x.
200° C
6 0-120 Se con d s
3° C / Se con d M a x.
217° C
6 0-150 Se con d s
T ab l e 2
30 Se con d s **
6 ° C / Se con d M a x.
8 Minut e s M a x.
* Tol e r a nc e for p ea k profil e t e mp e r a tur e (Tp) is de fin ed a s a suppli e r minimum a n d a us e r m a ximum.
** Tol e r a nc e for tim e a t p ea k profil e t e mp e r a tur e (tp) is de fin ed a s a suppli e r minimum a n d a us e r m a ximum.
North America
Europe
Asia Pacific
Cooper Electronic Technologies
1225 Broken Sound Parkway NW
Suite F
Boca Raton, FL 33487-3533
Tel: 1-561-998-4100
Fax: 1-561-241-6640
Cooper Bussmann
P.O. Box 14460
St. Louis, MO 63178-4460
Tel: 1-636-394-2877
Fax: 1-636-527-1607
Cooper Electronic Technologies
Cooper (UK) Limited
Burton-on-the-Wolds
Leicestershire ? LE12 5TH UK
Tel: +44 (0) 1509 882 737
Fax: +44 (0) 1509 882 786
Cooper Electronic Technologies
Avda. Santa Eulalia, 290
08223
Terrassa, (Barcelona), Spain
Tel: +34 937 362 812
+34 937 362 813
Cooper Electronic Technologies
1 Jalan Kilang Timor
#06-01 Pacific Tech Centre
Singapore 159303
Tel: +65 278 6151
Fax: +65 270 4160
Toll Free: 1-888-414-2645
Fax: +34 937 362 719
The only controlled copy of this Data Sheet is the electronic read-only version located on the Cooper Bussmann Network Drive. All other copies of this document are by definition uncon-
trolled. This bulletin is intended to clearly present comprehensive product data and provide technical information that will help the end user with design applications. Cooper Bussmann
reserves the right, without notice, to change design or construction of any products and to discontinue or limit distribution of any products. Cooper Bussmann also reserves the right to
change or update, without notice, any technical information contained in this bulletin. Once a product has been selected, it should be tested by the user in all possible applications.
Life Support Policy: Cooper Bussmann does not authorize the use of any of its products for use in life support devices or systems without the express written approval of an officer of the
Company. Life support systems are devices which support or sustain life, and whose failure to perform, when properly used in accordance with instructions for use provided in the label-
ing, can be reasonably expected to result in significant injury to the user.
? 2008 Cooper Bussmann
S t . L o u i s, M O 6 3 1 7 8
w w w. c o o p e r bu s s m a n n . c o m
1108
BU-SB08798
Page 4 of 4
Data Sheet: 4349
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